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 Advance Product Information
November 16, 2005
8.5 - 11 GHz 6-Bit Phase Shifter
* * * * * * *
TGP2103
Key Features and Performance
Frequency Range: 8.5 - 11 GHz 5dB Nominal Insertion Loss 2deg RMS Phase Error @ 9.5GHz 0.2dB RMS Amp. Error @ 9.5GHz Negative Control Voltage 0.5m MESFET Technology Chip dimensions: 3.25 x 3.48 x 0.15 mm (0.128 x 0.137 x 0.006 inches)
Primary Applications
* * Military Radar Transmit / Receive
Measured Performance Description
RMS Phase Shift Error (deg)
The TriQuint TGP2103 is a 6-bit digital phase shifter MMIC design using TriQuint's proven 0.5m MESFET process. The TGP2103 will support a variety of X-Band phased array applications including military radar. The 6-bit design utilizes a compact topology that achieves a 11.31mm2 die area and high performance. The TGP2103 provides a 6-bit digital phase shift function with a nominal 5dB insertion loss and 2 RMS phase shift error over a bandwidth of 8.5-11GHz. The TGP2103 requires a minimum of offchip components and operates with a 5V control voltage. Each device is RF tested on-wafer to ensure performance compliance. The device is available in chip form. Lead-Free and RoHS compliant
6 5 4 RMS Phase Shift Error RMS Am plitude Error
1.0 0.8 0.6
3 0.4 2 1 0 8.5 9.0 9.5 10.0 Frequency (GHz) 10.5 0.2 0.0 11.0
0 -1 -2 -3 S21 (dB) -4 -5 -6 -7 -8 -9 -10 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12 Frequency (GHz)
Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to change without notice.
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994-8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
November 16, 2005
TGP2103
TABLE I MAXIMUM RATINGS Symbol VC IC PIN PD TCH TM TSTG 1/ 2/ 3/ Parameter Control Voltage Range Control Supply Current Input Continuous Wave Power Power Dissipation Operating Channel Temperature Mounting Temperature (30 Seconds) Storage Temperature Value -8V to 0V 1 mA 20 dBm 0.1 W 150 C 320 C -65 to 150 0C
0 0
Notes 1/ 2/ 1/ 2/ 1/ 2/ 1/ 2/ 3/
These ratings represent the maximum operable values for this device Combinations of supply voltage, supply current, input power, and output power shall not exceed PD at a package base temperature of 70C Junction operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels.
TABLE II RF CHARACTERIZATIO N TAB LE (T A = 25qC , Nom inal) (V C = -5V ) P aram eter Insertion Loss Peak Am plitude Error RM S Am plitude Error Peak Phase Shift E rror RM S Phase S hift E rror Input Return Loss O utput Return Loss Test Conditions 8.5 - 11G Hz 8.5 - 11G Hz 8.5 - 11G Hz 8.5 - 11G Hz 8.5 - 11G Hz 8.5 - 11G Hz 8.5 - 11G Hz Typ 5 0.5 0.2 3 2 15 12 Units dB dB dB deg deg dB dB Notes
Note: Table II Lists the RF C haracteristics of typical devices as determ ined by fixtured m easurem ents.
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994-8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
November 16, 2005
TGP2103 Preliminary Measured Data
0 -1 -2 -3 S21 (dB) -4 -5 -6 -7 -8 -9 -10 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 Frequency (GHz) 11.0 11.5 12.0
10 RMS Phase Shift Error (deg) 9 8 7 6 5 4 3 2 1 0 7.0 7.5 8.0 RMS Phase Shift Error RMS Am plitude Error
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 Frequency (GHz)
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994-8504 Email: info-mmw@tqs.com Web: www.triquint.com
RMS Amplitude Error (dB)
Advance Product Information
November 16, 2005
TGP2103 Preliminary Measured Data
0 -3 -6 -9 S11 (dB) -12 -15 -18 -21 -24 -27 -30 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 Frequency (GHz) 11.0 11.5 12.0
0 -3 -6 -9 S22 (dB) -12 -15 -18 -21 -24 -27 -30 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 Frequency (GHz) 11.0 11.5 12.0
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994-8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
November 16, 2005
TGP2103 Preliminary Measured Data
10 8 Phase Shift Error (deg) 6 4 2 0 -2 -4 -6 -8 -10 1 5 4 Amplitude Error (dB) 3 2 1 0 -1 -2 -3 -4 -5 1 5 9 13 17 21 25 29 33 37 41 45 49 53 57 61 State
5
8 GHz 10 GHz
8.5 GHz 10.5 GHz
9 GHz 11 GHz
9.5 GHz 11.5 GHz
5
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13 17 21 25 29 33 37 41 45 49 53 57 61 State
8 GHz 10 GHz
8.5 GHz 10.5 GHz
9 GHz 11 GHz
9.5 GHz 11.5 GHz
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994-8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
November 16, 2005
State Table
State 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 V-5.625 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V 0V -5V V-11.25 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V 0V 0V -5V -5V V-22.5A 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V V-22.5B -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V -5V -5V -5V -5V 0V 0V 0V 0V V-45A -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V V-45B 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V V-90A -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V V-90B 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V V-180A -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V V-180B 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V 0V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V -5V
TGP2103
Phase Shift Reference 5.625 11.25 16.875 22.5 28.125 33.75 39.375 45 50.625 56.25 61.875 67.5 73.125 78.75 84.375 90 95.625 101.25 106.875 112.5 118.125 123.75 129.375 135 140.625 146.25 151.875 157.5 163.125 168.75 174.375 180 185.625 191.25 196.875 202.5 208.125 213.75 219.375 225 230.625 236.25 241.875 247.5 253.125 258.75 264.375 270 275.625 281.25 286.875 292.5 298.125 303.75 309.375 315 320.625 326.25 331.875 337.5 343.125 348.75 354.375
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994-8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
November 16, 2005
TGP2103 Mechanical Drawing
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994-8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
November 16, 2005
TGP2103 Chip Assembly & Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994-8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
November 16, 2005
TGP2103 Assembly Process Notes
Reflow process assembly notes: * * * * * Use AuSn (80/20) solder with limited exposure to temperatures at or above 300C. (30 seconds maximum) An alloy station or conveyor furnace with reducing atmosphere should be used. No fluxes should be utilized. Coefficient of thermal expansion matching is critical for long-term reliability. Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is critical during auto placement. Organic attachment can be used in low-power applications. Curing should be done in a convection oven; proper exhaust is a safety concern. Microwave or radiant curing should not be used because of differential heating. Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes: * * * * Thermosonic ball bonding is the preferred interconnect technique. Force, time, and ultrasonics are critical parameters. Aluminum wire should not be used. Maximum stage temperature is 200C.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994-8504 Email: info-mmw@tqs.com Web: www.triquint.com


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